No matter what type of LED to the need for different types of design package, because only the packaged end products in order to put into practical application. what is led bulb?
Why LED package ?
The LED package will lead to the electrodes of the LED chip, not only to protect the LED chip, and serve to improve the luminous efficiency. LED packaging is not just to complete the output signal is more important is to protect the normal work of the die, the output of visible light function. Shows both the electrical parameters of LED packaging, and optical parameters of design and technical requirements, is not a simple task.
2.LED package devices
Require a higher LED Street light package, therefore, whether the DIP LED or SMD LED must use high-precision solid crystal, because the location of the LED chip into the package is accurate and will directly affect the luminous efficiency of the whole package devices . If the location of the chip in the reflector cup is biased, the light can not be fully reflected, direct impact on the brightness of the LED. However, using an advanced PR System (pre-image recognition system) solid crystal machine, regardless of the quality of the lead frame difference can still be accurately LED chip soldered on a predetermined position.
Require a higher LED Street light package, therefore, whether the DIP LED or SMD LED must use high-precision solid crystal, because the location of the LED chip into the package is accurate and will directly affect the luminous efficiency of the whole package devices . If the location of the chip in the reflector cup is biased, the light can not be fully reflected, direct impact on the brightness of the LED. However, using an advanced PR System (pre-image recognition system) solid crystal machine, regardless of the quality of the lead frame difference can still be accurately LED chip soldered on a predetermined position.
3.LED package form
According to different applications, different dimensions of the cooling solution and the glow. LED packaging a variety of forms. At present, the LED package the classification of the Lamp-LED TOP-LED, Side-LED, SMD LED, High-Power-LED high bay, Flip Chip-LED, etc.
According to different applications, different dimensions of the cooling solution and the glow. LED packaging a variety of forms. At present, the LED package the classification of the Lamp-LED TOP-LED, Side-LED, SMD LED, High-Power-LED high bay, Flip Chip-LED, etc.
SMD LED (Surface Mount LEDs)
SMD LED is attached to the circuit board surface, suitable for SMT processing, reflow, and a good solution to the brightness, angle, flatness, reliability, consistency and other issues, the use of lighter PCB board and the reflective layer materials improved to remove the heavy carbon steel pin DIP LED, display the reflective layer need to be filled with epoxy resin less aims to reduce the size, lower weight. Product weight of the surface mount LED can be easily lightened by half, and ultimately make the application more perfect. what is led bulb?
SMD LED is attached to the circuit board surface, suitable for SMT processing, reflow, and a good solution to the brightness, angle, flatness, reliability, consistency and other issues, the use of lighter PCB board and the reflective layer materials improved to remove the heavy carbon steel pin DIP LED, display the reflective layer need to be filled with epoxy resin less aims to reduce the size, lower weight. Product weight of the surface mount LED can be easily lightened by half, and ultimately make the application more perfect. what is led bulb?
High-Power-LED (high-power LED)
In order to obtain high power, high brightness LED light source, manufacturers, high-power direction of the LED chip and package design to development. At present, able to withstand the number of W-power LED package. Multi-chip combinations such as Norlux series of high-power LED package structure of hexagonal aluminum base (non-conductive), the base diameter of 31.75mm, the emitting area is located in the center part of a diameter of about (0.375 × 25.4) mm can accommodate up to 40 LED die, aluminum as a heat sink. This package using conventional die combination of high-density package, high luminous efficiency, low thermal resistance, high optical output power at high current, but also a promising development in LED solid-state light source.
In order to obtain high power, high brightness LED light source, manufacturers, high-power direction of the LED chip and package design to development. At present, able to withstand the number of W-power LED package. Multi-chip combinations such as Norlux series of high-power LED package structure of hexagonal aluminum base (non-conductive), the base diameter of 31.75mm, the emitting area is located in the center part of a diameter of about (0.375 × 25.4) mm can accommodate up to 40 LED die, aluminum as a heat sink. This package using conventional die combination of high-density package, high luminous efficiency, low thermal resistance, high optical output power at high current, but also a promising development in LED solid-state light source.
what is led bulb? Visible, the power LED thermal characteristics of a direct impact to the operating temperature of LED luminescence efficiency, emission wavelength, life, power type LED chip package design, manufacturing technology is even more important.
没有评论:
发表评论